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Nanchang land port "Changsha-Xiamen-Hong Kong Link" rail-sea intermodal train was opened. On the morning of December 12th, two trains loaded with "Made in Jiangxi" drove out of Nanchang land port in turn under the supervision of Ganjiang New District Customs, marking the official opening of the "Changsha-Xiamen-Hong Kong Link" rail-sea intermodal train from Nanchang land port to Xiamen Port, which greatly boosted the construction of modern logistics system in Jiangxi to a new level. Compared with the past, under the new mode of "Changsha-Xiamen-Hong Kong Link", the transportation efficiency of goods destined for Southeast Asia is shortened by 5-7 days, and the transportation cost is reduced by 20%. (CCTV News)Market news: Britain is considering the largest auction of renewable energy subsidies in history.Turkey imposes additional tax on Iranian flat glass imports.

The USD/JPY rose more than 30 points against the Japanese yen in the short term and is now reported at 152.56.Xia Yiping's internal letter was alleged to have been copied from Weilai Li Bin. Xia Yiping, CEO of Jiyue, released an internal letter on the afternoon of 11th, acknowledging that the company was encountering difficulties and needed to adjust immediately. Some netizens pointed out that part of Xia Yiping's internal letter copied the internal letter of Weilai Li Bin in 2023. Xia Yiping's internal letter mentioned that the following four things must be done well in the new entrepreneurial period: 1. Adhere to the long-term investment in core technologies to maintain the leading edge; 2. Strengthen sales and service capacity building to cope with fierce market competition; 3. Merge departments and posts with duplicate functions and change inefficient internal workflow; 4. Reduce projects that cannot improve financial performance in the short term. In 2023, Li Bin's internal letter also mentioned: ensure long-term investment in core key technologies and maintain the leading edge of technology and products; Ensure that sales and service capabilities can cope with fierce market competition; Ensure that 9 core products of 3 brands are listed as scheduled; Organize efficiency improvement, merge redundant departments and posts, change inefficient internal workflow and division of labor, and cancel inefficient posts; Improve the efficiency of resources, postpone and reduce the project investment that can not improve the company's financial performance within 3 years. (Sina Technology)Extreme Vietnam insider: Xia Yiping still stays in the company's on-site office and is seeking financing. On the morning of the 12th, Xia Yiping, CEO of Extreme Vietnam, appeared in the company's headquarters office. Xia Yiping said that he appeared first to prove to employees that he had not run away, to tide over the difficulties with the company, and second to communicate with employees face to face. Network video shows that Xia Yiping is surrounded by many employees. The demands of employees mainly include paying social security, medical insurance and provident fund, paying wages and giving employees "N+1" compensation. Xia Yiping responded that knowing that everyone is very angry, everyone has followed us for so long, and I am very grateful. "These problems are being solved. Now I am communicating with you. If I escape, I will not come." Some employees in Vietnam confirmed this statement. "His main task at present is financing, and he is also actively contacting investors for help." Insiders revealed. (The Paper)

Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)The tenth batch of centralized procurement of drugs organized by the state will be opened in Shanghai today (12th), and the bid will be selected. It is understood that this collection involves a total of 62 drugs and 263 product specifications, which is the highest in all previous collections. Covers a variety of therapeutic fields such as hypertension, diabetes, tumor, cardiovascular and cerebrovascular diseases, infection, mental illness, and electrolyte supplementation. (CCTV Finance)Turkey imposes additional tax on Iranian flat glass imports.